Electro CLNR-PRO 300 is an ammonia-based low foaming alkaline concentrate detergent with pH 9-11. It is a technologically advanced cleaning chemistry designed to meet the challenges of semiconductor/wafer uneven surfaces in critical cleaning in FEOL and BEOL steps.
It does not contain chlorine or acids, to be diluted 1:30 with DI-Water.
It is chemically infused with electrostatic charges on the surface and the liquid particles. Electrostatic repulsion forces remove particles without additional mechanical force produced by mega-sonics or under-cut etching from elevated bath chemistries.
It works best with intricate surface patterns. The uneven surfaces present an increased degree of difficulty due to surface damage from high power mega-sonics and undercut etching combined with elevated chemistry temperatures.
Performs at ambient room temperatures in static or filtered recirculated baths.
Performs excellent at elevated temperatures and ultrasonic cycles.
It is a great substitute for NH4OH in an SC-1 or APM process chemistry. It is made on the basis of TMAH. (Tetramethylammonium hydroxide (TMAH) is widely used in micro- or nanofabrication as an etchant or developer). Our solution improves on results of SC-1(Standard Clean 1) or APM (Ammonia Peroxide Mixture) methods as it does not require heated temps or high power megasonic methods.
It can be used to clean Ti, TiN and W surfaces.
Request a free sample and consultation for your needs.